Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie
We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro
Electronics Forum | Tue Feb 13 14:52:32 EST 2018 | emeto
I am totally with SweetOldBob on this one. Contamination or voids can also help to boost this defect, but considering that you are probably entirely burning off your flux in the soak zone, you might be getting oxidation on your pads and actually get
Electronics Forum | Fri Mar 06 15:04:11 EST 1998 | Todd N
| We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | 1) Do you need
Electronics Forum | Fri Mar 06 23:02:43 EST 1998 | Scott McKee
| | We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | | 1) Do you
Electronics Forum | Thu Jul 29 23:21:51 EDT 1999 | CH Lee
I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. This ceramic substrate
Electronics Forum | Wed Mar 21 15:33:16 EDT 2007 | pjc
Not all OSPs are created equal. Some companies use N2 in their reflow oven to minimize oxidation during reflow. This is for double sided reflow and if wave or selective solder will be done after reflow. Get extra boards from the vendor to test. Run t
Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon
| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su
Electronics Forum | Fri Jul 30 14:50:26 EDT 1999 | Kevin Hussey
| I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | This ceramic substr
Electronics Forum | Wed Oct 06 04:11:35 EDT 2010 | grahamcooper22
I've done minimal research to this point and > understand my issue with solder on the double > sided boards is due to oxidation that occures on > the unpopulated pads when the board makes its > first trip through the reflow oven. > > We did run
Electronics Forum | Mon Oct 04 11:34:29 EDT 2010 | vetteboy86
I've done minimal research to this point and understand my issue with solder on the double sided boards is due to oxidation that occures on the unpopulated pads when the board makes its first trip through the reflow oven. We did run both sides in a
